… of porouslow-k dielectrics is a complex process involving … reduced degradation during plasma etchingprocesses. These … A more detailed deposition process and the porousstructure …
AV Miakonkikh, VO Kuzmenko, KV Rudenko - High Energy Chemistry, 2023 - Springer
… the atomic layer process of anisotropic plasma etching with low … effect is etching at significantly low temperatures. … porousstructure from deep penetration of active plasma radicals. …
… in the modern process flows to reduce the negative impact of … by the formation of a porous structure due to the removal of … of demethylated low-k can move at the same speed as the etch …
DV Lopaev, SM Zyryanov, AI Zotovich… - Journal of Physics D …, 2020 - iopscience.iop.org
… of the chemical structure of an OSG, due to the effects of different … Unsurprisingly, the main processes determining low-k … that under conventional conditions for low-ketching [6], plasma …
HW Tak, JK Jang, D Sung, DS Kim, DW Kim… - Materials …, 2020 - ingentaconnect.com
… for porous SiCOH by using plasma etchingmethods such as … etch characteristics of porous SiCOH such as etch rate, etch … , therefore, its green house effect can be much lower than …
A Pranda, S Grzeskowiak, YH Tsai… - Journal of Vacuum …, 2023 - pubs.aip.org
… annealing results in the films to be porous. The synthesis method results in … process chemistries and their impacts on the bonding structure and resulting etch behavior of several low-k …
N Hong, Y Zhang, Q Sun, W Fan, M Li, M Xie, W Fu - Materials, 2021 - mdpi.com
… from the original SiO 2 to porous SiCOH materials, as well as … because copper is not suitable for reactive ion etching due to … This effect is even more prominent as the exposure time of Ar/…
YK Sa, J Bang, J Son, DY Yu, YC Kim - Materials, 2021 - mdpi.com
… of 6 GPa for a porouslow-k film deposited by a conventional … To minimize the Si substrate effect in the measured values, … chemical and plasma etch and ash processes during BEOL …
Y Xiao, Z Ma, C Prawoto, C Zhou… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
… is formed on the Si3N4 etch-stop layer and successfully … In particular, spherical pores in the porouslow-k dielectric may … anisotropic low-k dielectric can withstand the CMP process …