… reduction methods in the etching of porous low-k dielectric, … ) processes and, the effects of
pulsed plasmas on the PID of … and the three peaks related to the low-k structure which are ‘Si-O…

… of porous low-k dielectrics is a complex process involving … reduced degradation during
plasma etching processes. These … A more detailed deposition process and the porous structure …

… the atomic layer process of anisotropic plasma etching with low … effect is etching at
significantly low temperatures. … porous structure from deep penetration of active plasma radicals. …

… in the modern process flows to reduce the negative impact of … by the formation of a porous
structure due to the removal of … of demethylated low-k can move at the same speed as the etch …

… of the chemical structure of an OSG, due to the effects of different … Unsurprisingly, the main
processes determining low-k … that under conventional conditions for low-k etching [6], plasma …

… for porous SiCOH by using plasma etching methods such as … etch characteristics of porous
SiCOH such as etch rate, etch … , therefore, its green house effect can be much lower than …

… annealing results in the films to be porous. The synthesis method results in … process
chemistries and their impacts on the bonding structure and resulting etch behavior of several low-k …

… from the original SiO 2 to porous SiCOH materials, as well as … because copper is not suitable
for reactive ion etching due to … This effect is even more prominent as the exposure time of Ar/…

… of 6 GPa for a porous low-k film deposited by a conventional … To minimize the Si substrate
effect in the measured values, … chemical and plasma etch and ash processes during BEOL …

… is formed on the Si3N4 etch-stop layer and successfully … In particular, spherical pores in
the porous low-k dielectric may … anisotropic low-k dielectric can withstand the CMP process …