[HTML][HTML] Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

M Blaicher, MR Billah, J Kemal, T Hoose… - Light: Science & …, 2020 - nature.com
… of conventional discrete-die systems can be combined with … for highly efficient optical
coupling between a broad range of … to be removed from the measurement setup for temperature …

[HTML][HTML] Hybrid and heterogeneous photonic integration

P Kaur, A Boes, G Ren, TG Nguyen, G Roelkens… - APL Photonics, 2021 - pubs.aip.org
… -sectional image of vertical optical coupling using the turning … In particular, we describe
flip-chip, die and wafer bonding, … a method to integrate and interconnect manufactured chip dies

Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

D Jevtics, JA Smith, J McPhillimy… - Optical Materials …, 2021 - opg.optica.org
Optical measurements of waveguide coupled resonators and … using an end-fire transmission
setup in the 1540 - 1600 nm … In this work we have presented transfer-printing methods that …

Flip-chip integration of InP to SiN photonic integrated circuits

M Theurer, M Moehrle, A Sigmund… - Journal of Lightwave …, 2020 - ieeexplore.ieee.org
… for single dies. Horizontal alignment is carried out by utilizing … optical power coupled to a SiN
waveguide with an averaged … The InP chip is bonded in a p-side down configuration into an …

[HTML][HTML] Grating couplers on silicon photonics: Design principles, emerging trends and practical issues

L Cheng, S Mao, Z Li, Y Han, HY Fu - Micromachines, 2020 - mdpi.com
… Then, we conclude various methods to improve their performance, including coupling … quality
control of bad dies. Unlike electrical measurement using DC probes, optical testing on GCs …

Micro‐transfer‐printed III‐V‐on‐silicon C‐band semiconductor optical amplifiers

B Haq, S Kumari, K Van Gasse, J Zhang… - Laser & Photonics …, 2020 - Wiley Online Library
… efficient optical coupling devices such as semiconductor optical … : with die-to-wafer bonding
unstructured III-V dies are bonded … The measurement setup used to characterize the SOAs …

Principles, fundamentals, and applications of programmable integrated photonics

D Pérez, I Gasulla, P Das Mahapatra… - Advances in Optics and …, 2020 - opg.optica.org
… aims at designing common integrated optical hardware resource configurations, capable of
coupling provides a periodic coupling factor varying from zero to complete cross coupling

Co-packaged photonics for high performance computing: status, challenges and opportunities

R Mahajan, X Li, J Fryman, Z Zhang… - Journal of Lightwave …, 2021 - ieeexplore.ieee.org
… The technical requirements to deliver the promise of co-… configuration to meet the power
targets at higher data rates [26]. … a 14nm FPGA die co-packaged with an optical die (TeraPHY …

Die attachment, wire bonding, and encapsulation process in LED packaging: A review

MA Alim, MZ Abdullah, MSA Aziz… - Sensors and Actuators A …, 2021 - Elsevier
… advances in die attachment, new wire bonding techniques, and … side and placed in a FC
configuration on the substrate. This … on the LED die to obtain excellent optical performance. The …

[HTML][HTML] Entanglement across separate silicon dies in a modular superconducting qubit device

A Gold, JP Paquette, A Stockklauser… - npj Quantum …, 2021 - nature.com
… of these methods are likely to outperform local gates between qubits, which can achieve
coupling … During the first exposure, focus and dose settings are selected to target the top wafer …