The development of a novel stacked package: Package in package

YC Kim - IEEE/CPMT/SEMI 29th International Electronics …, 2004 - ieeexplore.ieee.org
Stacked die chip scale packages (CSPs) or fine-pitch BGAs (FBGAs) have been readily
adopted and integrated in many handheld products, most notably cellular phones. Such …
被引用次数：21 相关文章

[引用][C] The development of a novel stacked package: Package in package

F CARSON, YC KIM - … symposium (San Jose CA CA, 14-16 …, 2004 - pascal-francis.inist.fr
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[引用][C] The development of a novel stacked package: Package in package

F CARSON, YC KIM - IEEE/CPMT/SEMI international electronics …, 2004