Impact of dielectric and copper via design on wafer-to-wafer hybrid bonding

V Dubey, D Wünsch, K Gottfried… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
Hybrid bonding is key to achieving high-quality interconnect interfaces for fine pitch
integration. It has an advantage over other types of interconnects as it allows a high I/O …
被引用次数：11 相关文章

Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding

V Dubey, D Wünsch, K Gottfried, M Wiemer, T Fischer… - conferences.computer.org
Hybrid bonding is key to achieving high-quality interconnect interfaces for fine pitch
integration. It has an advantage over other types of interconnects as it allows a high I/O …