[PDF][PDF] Advancements in stacked chip scale packaging (S-CSP), provides system-in-a-package functionality for wireless and handheld applications
M Kada, L Smith - Citeseer
To achieve continuous size, weight and cost reductions, wireless handset manufacturers
and their semiconductor suppliers have been developing new semiconductor devices and …
and their semiconductor suppliers have been developing new semiconductor devices and …
[引用][C] Advancements in Stacked Chip Scale Packaging (S-CSP), Provides System-in-a-Package Functionality for Wireless and Handheld Applications
M KADA - Proceedings of the Pan Pacific Microelectronics …, 2000 - cir.nii.ac.jp
Advancements in Stacked Chip Scale Packaging (S-CSP), Provides System-in-a-Package
Functionality for Wireless and Handheld Applications | CiNii Research CiNii 国立情報学研究所 …
Functionality for Wireless and Handheld Applications | CiNii Research CiNii 国立情報学研究所 …