Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

B Chao, SH Chae, X Zhang, KH Lu, J Im - Acta Materialia, 2007 - Elsevier
An efficient numerical method was developed to extract the diffusion and electromigration
parameters for multi-phase intermetallic compounds (IMC) formed as a result of material …
被引用次数：263 相关文章

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

B Chao, SH Chae, X Zhang, KH Lu, J Im, PS Ho - Acta Materialia, 2007 - infona.pl
An efficient numerical method was developed to extract the diffusion and electromigration
parameters for multi-phase intermetallic compounds (IMC) formed as a result of material …

[引用][C] Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

B Chao, SH Chae, X Zhang, KH Lu, J Im, PS Ho - Acta Materialia, 2007 - cir.nii.ac.jp
Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic
compounds in Pb-free solders using simulated annealing | CiNii Research CiNii 国立情報学 …

Investigation of diffusion and electromigration parameters for Cu-Sn intermetallic compounds in Pb-free solders using simulated annealing

B Chao, SH Chae, X Zhang, KH Lu, J Im… - Acta …, 2007 - ui.adsabs.harvard.edu
An efficient numerical method was developed to extract the diffusion and electromigration
parameters for multi-phase intermetallic compounds (IMC) formed as a result of material …

[引用][C] Investigation of diffusion and electromigration parameters for Cu-Sn intermetallic compounds in Pb-free solders using simulated annealing

B CHAO, SH CHAE, X ZHANG, KH LU, J IM… - Acta …, 2007 - pascal-francis.inist.fr
Investigation of diffusion and electromigration parameters for Cu-Sn intermetallic
compounds in Pb-free solders using simulated annealing CNRS Inist Pascal-Francis CNRS …
[PDF] psu.edu

[PDF][PDF] Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

B Chao, SH Chae, X Zhang, KH Lu, J Im, PS Ho - Acta Materialia, 2007 - Citeseer
An efficient numerical method was developed to extract the diffusion and electromigration
parameters for multi-phase intermetallic compounds (IMC) formed as a result of material …
[PDF] researchgate.net

[PDF][PDF] Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

B Chao, SH Chae, X Zhang, KH Lu, J Im, PS Ho - Acta Materialia, 2007 - researchgate.net
An efficient numerical method was developed to extract the diffusion and electromigration
parameters for multi-phase intermetallic compounds (IMC) formed as a result of material …
[PDF] psu.edu

[PDF][PDF] Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

B Chao, SH Chae, X Zhang, KH Lu, J Im, PS Ho - Acta Materialia, 2007 - Citeseer
An efficient numerical method was developed to extract the diffusion and electromigration
parameters for multi-phase intermetallic compounds (IMC) formed as a result of material …

[引用][C] Investigation of diffusion and electromigration parameters for Cu-Sn intermetallic compounds in Pb-free solders using simulated annealing

B CHAO, SH CHAE, X ZHANG, KH LU, J IM, PS HO - Acta materialia, 2007 - Elsevier