1μm Pitch direct hybrid bonding with< 300nm wafer-to-wafer overlay accuracy

A Jouve, V Balan, N Bresson… - 2017 IEEE SOI-3D …, 2017 - ieeexplore.ieee.org
Copper/oxide hybrid bonding process has been extensively studied these past years as a
key enabler for 3D high density application with top and bottom tier interconnection pitch …
被引用次数：51 相关文章

1μm Pitch direct hybrid bonding with< 300nm wafer-to-wafer overlay accuracy

A Jouve, V Balan, N Bresson… - 2017 IEEE SOI-3D …, 2017 - cea.hal.science
Copper/oxide hybrid bonding process has been extensively studied these past years as a
key enabler for 3D high density application with top and bottom tier interconnection pitch …

1μm Pitch direct hybrid bonding with< 300nm wafer-to-wafer overlay accuracy

A Jouve, V Balan, N Bresson… - 2017 IEEE SOI-3D …, 2017 - hal.science
Copper/oxide hybrid bonding process has been extensively studied these past years as a
key enabler for 3D high density application with top and bottom tier interconnection pitch …