Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects
This article presents a full‐wave electromagnetic approach for analyzing the electrical
performance of massively coupled through silicon vias (TSV). The TSVs are modeled with …
performance of massively coupled through silicon vias (TSV). The TSVs are modeled with …
Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects
B Wu, X Gu, L Tsang, MB Ritter - Microwave and Optical …, 2011 - research.ibm.com
This article presents a full-wave electromagnetic approach for analyzing the electrical
performance of massively coupled through silicon vias (TSV). The TSVs are modeled with …
performance of massively coupled through silicon vias (TSV). The TSVs are modeled with …
Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects
B Wu, X Gu, L Tsang, MB Ritter - Microwave and Optical Technology …, 2011 - infona.pl
This article presents a full‐wave electromagnetic approach for analyzing the electrical
performance of massively coupled through silicon vias (TSV). The TSVs are modeled with …
performance of massively coupled through silicon vias (TSV). The TSVs are modeled with …
[PDF][PDF] ELECTROMAGNETIC MODELING OF MASSIVELY COUPLED THROUGH SILICON VIAS FOR 3D INTERCONNECTS
B Wu, X Gu, L Tsang, MB Ritter - MICROWAVE AND OPTICAL …, 2011 - Citeseer
This article presents a full-wave electromagnetic approach for analyzing the electrical
performance of massively coupled through silicon vias (TSV). The TSVs are modeled with …
performance of massively coupled through silicon vias (TSV). The TSVs are modeled with …