3D packaging: Where all technologies come together

IEEE/CPMT/SEMI 29th International Electronics …, 2004 - ieeexplore.ieee.org
Cell phones and consumer products like digital cameras, PDAs and other wireless devices
require maximum functional integration in the smallest footprint, lowest profile and low cost …
被引用次数：103 相关文章

[引用][C] 3-D packaging: Where all technologies come together

M KARNEZOS - … technology symposium (San Jose CA CA, 14 …, 2004 - pascal-francis.inist.fr
3-D packaging : Where all technologies come together CNRS Inist Pascal-Francis CNRS
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[引用][C] 3-D packaging: Where all technologies come together

M KARNEZOS - IEEE/CPMT/SEMI international electronics …, 2004