Dense, Hard, and Thermally Stable Al6Si2O13–Mg2Al4Si5O18 Composite Material for Silicon Substrate Applications

A Keziz, M Heraiz, F Sahnoune, K Laziri, D Redaoui… - Silicon, 2023 - Springer
One of the key problems to overcome, in the development of electronic substrates, is that of
thermal distortion because of thermal mismatch between silicon and the substrate. The aim …

[PDF][PDF] Dense, Hard, and Thermally Stable Al

A Keziz, M Heraiz, F Sahnoune, K Laziri, D Redaoui… - 2023 - num.univ-msila.dz
One of the key problems to overcome, in the development of electronic substrates, is that of
thermal distortion because of thermal mismatch between silicon and the substrate. The aim …

[PDF][PDF] Dense, Hard, and Thermally Stable Al

A Keziz, M Heraiz, F Sahnoune, K Laziri, D Redaoui… - 2023 - researchgate.net
One of the key problems to overcome, in the development of electronic substrates, is that of
thermal distortion because of thermal mismatch between silicon and the substrate. The aim …

[PDF][PDF] Dense, Hard, and Thermally Stable Al

A Keziz, M Heraiz, F Sahnoune, K Laziri, D Redaoui… - 2023 - researchgate.net
One of the key problems to overcome, in the development of electronic substrates, is that of
thermal distortion because of thermal mismatch between silicon and the substrate. The aim …