Selections of working conditions for creep feed grinding. Part (I)–thermal partition ratios

SB Wang, HS Kou - The International Journal of Advanced Manufacturing …, 2004 - Springer
A thermal model focused on the heat transfer to the fluid, workpiece and grain is developed
for creep feed grinding. In this model, the conduction effect in the moving direction of the …

Selections of working conditions for creep feed grinding. Part (I)–thermal partition ratios

SB Wang, HS Kou - The International Journal of Advanced …, 2004 - search.proquest.com
A thermal model focused on the heat transfer to the fluid, workpiece and grain is developed
for creep feed grinding. In this model, the conduction effect in the moving direction of the …

Selections of working conditions for creep feed grinding. Part (I)-thermal partition ratios

S Wang, HS Kou - The International Journal of Advanced Manufacturing …, 2004 - elibrary.ru
A thermal model focused on the heat transfer to the fluid, workpiece and grain is developed
for creep feed grinding. In this model, the conduction effect in the moving direction of the …

Selections of working conditions for creep feed grinding. Part (I) thermal partition ratios

SB Wang, HS Kou - The International Journal of Advanced Manufacturing …, 2004 - infona.pl
A thermal model focused on the heat transfer to the fluid, workpiece and grain is developed
for creep feed grinding. In this model, the conduction effect in the moving direction of the …

Selections of working conditions for creep feed grinding. Part (I)–thermal partition ratios.

SB Wang, HS Kou - International Journal of Advanced …, 2004 - search.ebscohost.com
A thermal model focused on the heat transfer to the fluid, workpiece and grain is developed
for creep feed grinding. In this model, the conduction effect in the moving direction of the …

Selections of working conditions for creep feed grinding. Part (I)–thermal partition ratios.

SB Wang, HS Kou - International Journal of Advanced …, 2004 - search.ebscohost.com
A thermal model focused on the heat transfer to the fluid, workpiece and grain is developed
for creep feed grinding. In this model, the conduction effect in the moving direction of the …

[引用][C] Selections of working conditions for creep feed grinding. Part (I)–thermal partition ratios

SB Wang, HS Kou - The International Journal of Advanced Manufacturing …, 2004 - Springer