A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits

Applied Physics Letters, 2018 - pubs.aip.org
Laboratory transmission X-ray microscopy with a spatial resolution of about 100 nm was
used to image 3D interconnect structures and failures in microchips during mechanical …
被引用次数：14 相关文章

A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits

K Kutukova, S Niese, C Sander, Y Standke… - Applied Physics …, 2018 - pubs.aip.org
Laboratory transmission X-ray microscopy with a spatial resolution of about 100nm was
used to image 3D interconnect structures and failures in microchips during mechanical …

A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits

K Kutukova, S Niese, C Sander… - Applied Physics …, 2018 - ui.adsabs.harvard.edu
Laboratory transmission X-ray microscopy with a spatial resolution of about 100 nm was
used to image 3D interconnect structures and failures in microchips during mechanical …

A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits

K Kutukova, S Niese, C Sander, Y Standke, J Gluch… - 2018 - publica.fraunhofer.de
Laboratory transmission X-ray microscopy with a spatial resolution of about 100 nm was
used to image 3D interconnect structures and failures in microchips during mechanical …