Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

E Beyne, SW Kim, L Peng, N Heylen… - 2017 IEEE …, 2017 - ieeexplore.ieee.org
This paper presents a novel approach to face-to-face wafer-to-wafer (W2W) bonding using
SiCN-to-SiCN dielectric bonding, in combination with direct Cu-Cu bonding using Cu pads …
被引用次数：161 相关文章

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

E Beyne, SW Kim, L Peng, N Heylen… - 2017 IEEE …, 2017 - ieeexplore.ieee.org
This paper presents a novel approach to face-to-face wafer-to-wafer (W2W) bonding using
SiCN-to-SiCN dielectric bonding, in combination with direct Cu-Cu bonding using Cu pads …

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

E Beyne, SW Kim, L Peng, N Heylen… - Technical Digest …, 2018 - scholarworks.bwise.kr
This paper presents a novel approach to face-to-face wafer-to-wafer (W2W) bonding using
SiCN-to-SiCN dielectric bonding, in combination with direct Cu-Cu bonding using Cu pads …

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

E Beyne, SW Kim, L Peng, N Heylen… - TECHNICAL …, 2017 - repository.hanyang.ac.kr
This paper presents a novel approach to face-to-face wafer-to-wafer (W2W) bonding using
SiCN-to-SiCN dielectric bonding, in combination with direct Cu-Cu bonding using Cu pads …

[引用][C] Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

E Beyne, SW Kim, L Peng, N Heylen… - 2017 - imec-publications.be
Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology
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[引用][C] Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

E Beyne, SW Kim, L Peng, N Heylen… - 2017 IEEE International …, 2017 - cir.nii.ac.jp
Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology |
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