Accuracy-improved through-silicon-via model using conformal mapping technique

TY Cheng, CD Wang, YP Chiou… - 2011 IEEE 20th …, 2011 - ieeexplore.ieee.org
In this paper, the effects of slow wave and dielectric quasi-TEM modes in through-silicon via
(TSV) are analyzed by using the currently used TSV model. By the E-field plot, if pitch-to …
被引用次数：8 相关文章

Accuracy-improved through-silicon-via model using conformal mapping technique

TY Cheng, CD Wang, YP Chiou, TL Wu - 2011 IEEE 20th Conference on … - infona.pl
In this paper, the effects of slow wave and dielectric quasi-TEM modes in through-silicon via
(TSV) are analyzed by using the currently used TSV model. By the E-field plot, if pitch-to …