Methods and designs for improving the signal integrity of vertical interconnects in high performance packaging

B Wu, HL Lo - Progress In Electromagnetics Research, 2012 - jpier.org
Abstract Design of high performance package interconnects using full-wave electromagnetic
solvers is necessary due to increased operation speed, miniaturization and vertical 3D …
被引用次数：24 相关文章
[PDF] jpier.org

[PDF][PDF] METHODS AND DESIGNS FOR IMPROVING THE SIGNAL INTEGRITY OF VERTICAL INTERCONNECTS IN HIGH PERFORMANCE PACKAGING

B Wu, HL Lo - Progress In Electromagnetics Research, 2012 - jpier.org
Design of high performance package interconnects using full-wave electromagnetic solvers
is necessary due to increased operation speed, miniaturization and vertical 3D integration …
[PDF] archive.org

[PDF][PDF] METHODS AND DESIGNS FOR IMPROVING THE SIGNAL INTEGRITY OF VERTICAL INTERCONNECTS IN HIGH PERFORMANCE PACKAGING

B Wu, HL Lo - Progress In Electromagnetics Research, 2012 - scholar.archive.org
Design of high performance package interconnects using full-wave electromagnetic solvers
is necessary due to increased operation speed, miniaturization and vertical 3D integration …

Methods and designs for improving the signal integrity of vertical interconnects in high performance packaging

B Wu, HL Lo - Progress In Electromagnetics Research, 2012 - go.gale.com
Design of high performance package interconnects using full-wave electromagnetic solvers
is necessary due to increased operation speed, miniaturization and vertical 3D integration …
[PDF] researchgate.net

[PDF][PDF] METHODS AND DESIGNS FOR IMPROVING THE SIGNAL INTEGRITY OF VERTICAL INTERCONNECTS IN HIGH PERFORMANCE PACKAGING

B Wu, HL Lo - Progress In Electromagnetics Research, 2012 - researchgate.net
Design of high performance package interconnects using full-wave electromagnetic solvers
is necessary due to increased operation speed, miniaturization and vertical 3D integration …

METHODS AND DESIGNS FOR IMPROVING THE SIGNAL INTEGRITY OF VERTICAL INTERCONNECTS IN HIGH PERFORMANCE PACKAGING.

B Wu, HL Lo - Progress in Electromagnetics Research, 2012 - search.ebscohost.com
Abstract Design of high performance package interconnects using full-wave electromagnetic
solvers is necessary due to increased operation speed, miniaturization and vertical 3D …
[PDF] researchgate.net

[PDF][PDF] METHODS AND DESIGNS FOR IMPROVING THE SIGNAL INTEGRITY OF VERTICAL INTERCONNECTS IN HIGH PERFORMANCE PACKAGING

B Wu, HL Lo - Progress In Electromagnetics Research, 2012 - researchgate.net
Design of high performance package interconnects using full-wave electromagnetic solvers
is necessary due to increased operation speed, miniaturization and vertical 3D integration …