3D semiconductor device and structure with back-bias
Z Or-Bach, DC Sekar, B Cronquist, I Beinglass… - US Patent …, 2015 - Google Patents
H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state
devices during manufacture or treatment thereof; Apparatus specially adapted for handling …
devices during manufacture or treatment thereof; Apparatus specially adapted for handling …
System comprising a semiconductor device and structure
Z Or-Bach, DC Sekar, B Cronquist… - US Patent App. 13 …, 2012 - Google Patents
H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state
devices during manufacture or treatment thereof; Apparatus specially adapted for handling …
devices during manufacture or treatment thereof; Apparatus specially adapted for handling …
3D semiconductor device and structure with back-bias
Z Or-bach, DC Sekar, B Cronquist… - US Patent …, 2015 - freepatentsonline.com
A 3D semiconductor device, including: a first layer including first transistors; a first
interconnection layer interconnecting the first transistors and includes aluminum or copper; a …
interconnection layer interconnecting the first transistors and includes aluminum or copper; a …
SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE
Z Or-bach, DC Sekar, B Cronquist… - US Patent App. 13 …, 2012 - freepatentsonline.com
A method of manufacturing a semiconductor device, the method including, providing a first
monocrystalline layer including semiconductor regions, overlaying the first monocrystalline …
monocrystalline layer including semiconductor regions, overlaying the first monocrystalline …