Thermal coupling in integrated circuits: application to thermal testing

IEEE Journal of Solid-State Circuits, 2001 - ieeexplore.ieee.org
The power dissipated by the devices of a circuit can be construed as a signature of the
circuit's performance and state. Without disturbing the circuit operation, this power …
被引用次数：89 相关文章

Thermal coupling in integrated circuits: Application to thermal testing

J Altet, A Rubio, E Schaub, S Dilhaire… - IEEE Journal of Solid …, 2001 - hal.science
The power dissipated by the devices of a circuit can be construed as a signature of the
circuit's performance and state. Without disturbing the circuit operation, this power …
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[PDF][PDF] Thermal Coupling in Integrated Circuits: Application to Thermal Testing

J Altet, A Rubio, E Schaub, S Dilhaire… - IEEE JOURNAL OF …, 2001 - scholar.archive.org
The power dissipated by the devices of a circuit can be construed as a signature of the
circuit's performance and state. Without disturbing the circuit operation, this power …

[引用][C] Thermal coupling in integrated circuits: Application to thermal testing

A HAMADA - IEEE J. Solid-State Circuits, 2001 - cir.nii.ac.jp

[引用][C] Thermal coupling in integrated circuits: application to thermal testing

J Altet, A Rubio, E Schaub… - IEEE Journal of Solid …, 2001 - ui.adsabs.harvard.edu
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