[PDF][PDF] Development of a Bonding Concept for MOEMS Packaging: Reactive Nanocomposites
MP Kremer - core.ac.uk
Most modern bonding techniques in microsystems technologies make use of high
temperatures. While this is necessary to establish strong bonding forces, it can cause …
temperatures. While this is necessary to establish strong bonding forces, it can cause …
[PDF][PDF] Development of a Bonding Concept for MOEMS Packaging: Reactive Nanocomposites
DIMP Kremer - 2018 - scholar.archive.org
Most modern bonding techniques in microsystems technologies make use of high
temperatures. While this is necessary to establish strong bonding forces, it can cause …
temperatures. While this is necessary to establish strong bonding forces, it can cause …
Development of a Bonding Concept for MOEMS Packaging: Reactive Nanocomposites
MP Kremer - 2019 - publikationen.bibliothek.kit.edu
In nahezu allen modernen Fügetechnologien, die in der Mikrosystemtechnik Anwendung
finden, kommen hohe Temperaturen zum Einsatz. Zwar sind diese notwendig, um die …
finden, kommen hohe Temperaturen zum Einsatz. Zwar sind diese notwendig, um die …