Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS/IC package

Y Shimooka, M Inoue, M Endo, S Obata… - 2008 58th Electronic …, 2008 - ieeexplore.ieee.org
This paper reports a thin-film encapsulation technology for wafer level micro-electro-
mechanical systems (MEMS) package, using poly-benzo-oxazole (PBO) sacrificial material …
被引用次数：25 相关文章

[引用][C] Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS/IC package

Y Shimooka, M Inoue, M Endo, S Obata… - 2008 58th Electronic …, 2008 - cir.nii.ac.jp
Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS / IC package
| CiNii Research CiNii 国立情報学研究所 学術情報ナビゲータ[サイニィ] 詳細へ移動 検索フォームへ …

Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS/IC package

Y Shimooka, M Inoue, M Endo, S Obata, A Kojima… - 2008 58th Electronic … - infona.pl
This paper reports a thin-film encapsulation technology for wafer level micro-electro-
mechanical systems (MEMS) package, using poly-benzo-oxazole (PBO) sacrificial material …