Conductive pad structure for hybrid bonding and methods of forming same
SC Chen, SP Chou, YC Chu, CH Chou… - US Patent …, 2016 - Google Patents
BACKGROUND Typically, in a semiconductor device, various electronic components (eg,
transistors, diodes, resistors, capacitors, and the like) are formed in device dies on a wafer …
transistors, diodes, resistors, capacitors, and the like) are formed in device dies on a wafer …
Conductive pad structure for hybrid bonding and methods of forming same
S Chen, SP Chou, Y Chu, C Chou… - US Patent …, 2016 - freepatentsonline.com
A method embodiment includes patterning an opening through a layer at a surface of a
device die. The method further includes forming a liner on sidewalls of the opening …
device die. The method further includes forming a liner on sidewalls of the opening …
Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same
SC Chen, SP Chou, YC Chu, CH Chou… - US Patent App. 14 …, 2015 - Google Patents
BACKGROUND 0002 Typically, in a semiconductor device, various elec tronic components
(eg, transistors, diodes, resistors, capaci tors, and the like) are formed in device dies on a …
(eg, transistors, diodes, resistors, capaci tors, and the like) are formed in device dies on a …
Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same
S Chen, SP Chou, Y Chu, C Chou… - US Patent App. 14 …, 2015 - freepatentsonline.com
A method embodiment includes patterning an opening through a layer at a surface of a
device die. The method further includes forming a liner on sidewalls of the opening …
device die. The method further includes forming a liner on sidewalls of the opening …