Integration of electronic elements on the backside of a semiconductor die
V Ramachandran, U Ray - US Patent App. 14/499,151, 2016 - Google Patents
BACKGROUND 0002 Advances in the design and manufacture of semi conductor devices
have led to shrinking sizes of semiconduc torpackages, wafers, and dies/chips. As …
have led to shrinking sizes of semiconduc torpackages, wafers, and dies/chips. As …
INTEGRATION OF ELECTRONIC ELEMENTS ON THE BACKSIDE OF A SEMICONDUCTOR DIE
V Ramachandran, U Ray - US Patent App. 14/499,151, 2016 - freepatentsonline.com
Systems and methods include a first semiconductor die with a substrate having a first side
and a second side opposite to the first side. A first set of electronic elements is integrated on …
and a second side opposite to the first side. A first set of electronic elements is integrated on …