High density PoP (package-on-package) and package stacking development
M Dreiza, A Yoshida, K Ishibashi… - 2007 Proceedings 57th …, 2007 - ieeexplore.ieee.org
This paper presents information concerning high density package-on-package (PoP)
development which utilizes 0.5 mm top land pitch with solder on pad (SOP). Depending on …
development which utilizes 0.5 mm top land pitch with solder on pad (SOP). Depending on …
High Density PoP (Package-on-Package) and Package Stacking Development
M Dreiza, A Yoshida, K Ishibashi, T Maeda - 2007 Proceedings 57th Electronic … - infona.pl
This paper presents information concerning high density package-on-package (PoP)
development which utilizes 0.5 mm top land pitch with solder on pad (SOP). Depending on …
development which utilizes 0.5 mm top land pitch with solder on pad (SOP). Depending on …
[PDF][PDF] High Density PoP (Package-on-Package) and Package Stacking Development
M Dreiza, A Yoshida, K Ishibashi, T Maeda - researchgate.net
This paper presents information concerning high density Package-on-Package (PoP)
development which utilizes 0.5 mm top land pitch with solder on pad (SOP). Depending on …
development which utilizes 0.5 mm top land pitch with solder on pad (SOP). Depending on …
[PDF][PDF] High Density PoP (Package-on-Package) and Package Stacking Development
M Dreiza, A Yoshida, K Ishibashi, T Maeda - researchgate.net
This paper presents information concerning high density Package-on-Package (PoP)
development which utilizes 0.5 mm top land pitch with solder on pad (SOP). Depending on …
development which utilizes 0.5 mm top land pitch with solder on pad (SOP). Depending on …