Investigation of Cu/low-k film delamination in flip chip packages
U Ozkan, A Dubey, RN Master - 56th Electronic Components …, 2006 - ieeexplore.ieee.org
Chip-package-interaction (CPI) induced BEoL (back-end-of-line) delamination has emerged
as a major reliability concern with the adoption of Cu/low-k as the mainstream BEoL …
as a major reliability concern with the adoption of Cu/low-k as the mainstream BEoL …
Investigation of Cu/low-k film delamination in flip chip packages
CJ Zhai, U Ozkan, A Dubey, RC Blish, RN Master - 56th Electronic Components … - infona.pl
Chip-package-interaction (CPI) induced BEoL (back-end-of-line) delamination has emerged
as a major reliability concern with the adoption of Cu/low-k as the mainstream BEoL …
as a major reliability concern with the adoption of Cu/low-k as the mainstream BEoL …
[引用][C] Investigation of Cu/low-k film delamination in flip chip packages
CJ ZHAI - Proc. 56th Electronic Components and Technol. Conf …, 2006 - cir.nii.ac.jp
Investigation of Cu/low-k film delamination in flip chip packages | CiNii Research CiNii 国立
情報学研究所 学術情報ナビゲータ[サイニィ] 詳細へ移動 検索フォームへ移動 論文・データをさがす …
情報学研究所 学術情報ナビゲータ[サイニィ] 詳細へ移動 検索フォームへ移動 論文・データをさがす …