3D-stacked memory architectures for multi-core processors
GH Loh - ACM SIGARCH computer architecture news, 2008 - dl.acm.org
Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …
thereby significantly reducing wire delay between the two. Previous studies have examined …
3D-Stacked Memory Architectures for Multi-core Processors
GH Loh - 2008 International Symposium on Computer … - infona.pl
Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …
thereby significantly reducing wire delay between the two. Previous studies have examined …
[PDF][PDF] 3D-Stacked Memory Architectures for Multi-Core Processors
GH Loh - cs.cmu.edu
Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …
thereby significantly reducing wire delay between the two. Previous studies have examined …
3D-Stacked Memory Architectures for Multi-core Processors
GH Loh - Proceedings of the 35th Annual International …, 2008 - dl.acm.org
Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …
thereby significantly reducing wire delay between the two. Previous studies have examined …
[PDF][PDF] 3D-Stacked Memory Architectures for Multi-Core Processors
GH Loh - scholar.archive.org
Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …
thereby significantly reducing wire delay between the two. Previous studies have examined …
[PDF][PDF] 3D-Stacked Memory Architectures for Multi-Core Processors
GH Loh - courses.e-ce.uth.gr
Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …
thereby significantly reducing wire delay between the two. Previous studies have examined …
[PDF][PDF] 3D-Stacked Memory Architectures for Multi-Core Processors
GH Loh - pages.cs.wisc.edu
Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …
thereby significantly reducing wire delay between the two. Previous studies have examined …
[PDF][PDF] 3D-Stacked Memory Architectures for Multi-Core Processors
GH Loh - courses.engr.illinois.edu
Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …
thereby significantly reducing wire delay between the two. Previous studies have examined …
3D-Stacked Memory Architectures for Multi-core Processors
GH Loh - Computer Architecture, International Symposium on, 2008 - computer.org
Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two.?? Previous studies have …
thereby significantly reducing wire delay between the two.?? Previous studies have …
3D-Stacked Memory Architectures for Multi-core Processors
GH Loh - 2008 International Symposium on Computer …, 2008 - ieeexplore.ieee.org
Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …
thereby significantly reducing wire delay between the two. Previous studies have examined …