3-D stacked package technology and trends

FP Carson, YC Kim, IS Yoon - Proceedings of the IEEE, 2009 - ieeexplore.ieee.org
The need to integrate more device technology in a given board space for handheld
applications such as mobile phones has driven the adoption of innovative packages which …
被引用次数：64 相关文章

[引用][C] 3-D Stacked Package Technology and Trends: Developed for mobile equipment, packages of stacked logic and memory devices continue to improve and new …

FP CARSON, YC KIM, INS YOON - Proceedings of the IEEE, 2009 - pascal-francis.inist.fr
3-D Stacked Package Technology and Trends : Developed for mobile equipment, packages
of stacked logic and memory devices continue to improve and new variations are being …

3-D Stacked Package Technology and Trends

FP Carson, YC Kim, IS Yoon - Proceedings of the IEEE, 2009 - infona.pl
The need to integrate more device technology in a given board space for handheld
applications such as mobile phones has driven the adoption of innovative packages which …

[引用][C] 3-D Stacked Package Technology and Trends

FP CARSON - Proceedings of the IEEE, 2009 - cir.nii.ac.jp

[引用][C] 3-D Stacked Package Technology and Trends

FP Carson, YC Kim, IS Yoon - Proceedings of the IEEE, 2009 - cir.nii.ac.jp
3-D Stacked Package Technology and Trends | CiNii Research CiNii 国立情報学研究所 学術
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3-D Stacked Package Technology and Trends

FP Carson, YC Kim, IS Yoon - Proceedings of the IEEE, 2009 - infona.pl
The need to integrate more device technology in a given board space for handheld
applications such as mobile phones has driven the adoption of innovative packages which …