Edge coupling device fabrication
BACKGROUND In optical transceivers, it is desirable to integrate as many photonic
components in one chip as possible. As integration density increases and the sizes of …
components in one chip as possible. As integration density increases and the sizes of …
Edge coupling device fabrication
H Pan, Z Liu, H Wei, H Chen - US Patent 9,703,039, 2017 - freepatentsonline.com
A method of fabricating an edge coupling device and an edge coupling device are provided.
The method includes removing a portion of cladding material to form a trench over an …
The method includes removing a portion of cladding material to form a trench over an …
Edge Coupling Device Fabrication
H Pan, Z Liu, HZ Wei, H Chen - US Patent App. 14/680,917, 2015 - Google Patents
BACKGROUND 0004. In optical transceivers, it is desirable to integrate as many photonic
components in one chip as possible. As inte gration density increases and the sizes of …
components in one chip as possible. As inte gration density increases and the sizes of …
Edge Coupling Device Fabrication
H Pan, Z Liu, H Wei, H Chen - US Patent App. 14/680,917, 2015 - freepatentsonline.com
A method of fabricating an edge coupling device and an edge coupling device are provided.
The method includes removing a portion of cladding material to form a trench over an …
The method includes removing a portion of cladding material to form a trench over an …