Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability
F Fournel, C Euvrard, Y Exbrayat… - 2018 IEEE …, 2018 - ieeexplore.ieee.org
This paper presents the description of direct hybrid bonding technology for the fabrication of
vertical interconnects thanks to wafer-to-wafer bonding. Process robustness is analyzed …
vertical interconnects thanks to wafer-to-wafer bonding. Process robustness is analyzed …
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability
L Arnaud, S Moreau, A Jouve, I Jani, D Lattard… - 2018 IEEE International …, 2018 - dl.acm.org
This paper presents the description of direct hybrid bonding technology for the fabrication of
vertical interconnects thanks to wafer-to-wafer bonding. Process robustness is analyzed …
vertical interconnects thanks to wafer-to-wafer bonding. Process robustness is analyzed …