Recent studies show that the nonuniform thermal distribution on the substrate and
interconnects has impact on the circuit reliability and performance. Hence three-dimensional …

In deep sub-micron technologies, process variations can cause significant path delay and
clock skew uncertainties thereby lead to timing failure and yield loss. In this paper, we …

Recent studies show that the nonuniform thermal distribu-tion on the substrate and
interconnects has impact on the circuit reliability and performance. Hence three-dimensional …