Reliable 300 mm wafer level hybrid bonding for 3D stacked CMOS image sensors

S Lhostis, A Farcy, E Deloffre, F Lorut… - 2016 IEEE 66th …, 2016 - ieeexplore.ieee.org
3D Stacked Image sensor is the stacking of a Back-Side Illuminated (BSI) CMOS Image
Sensor on a logic die. It enables compact size, higher performances and additional …
被引用次数：113 相关文章

[引用][C] Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S Lhostis, A Farcy, E Deloffre, F Lorut… - 2016 IEEE 66th …, 2016 - cir.nii.ac.jp

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S Lhostis, A Farcy, E Deloffre, F Lorut, S Mermoz… - 2016 IEEE 66th Electronic … - infona.pl
3D Stacked Image sensor is the stacking of a Back-Side Illuminated (BSI) CMOS Image
Sensor on a logic die. It enables compact size, higher performances and additional …