… Therefore, considering the constant pitch reduction need of component roadmaps, the …
hybrid bonding process optimization achieved on 300mm wafers to enable down to 1µm pitch …

Direct bond interconnect (DBI) processes enable chip to chip, low resistivity electrical
connections for 2.5-D scaling of electrical circuits and heterogenous integration. This work …

… ) hybrid bonding has been demonstrated at pad size and pitch as small as 1 μm pad on 2 μm
pitch [… bonder and allow direct comparison to results from our test vehicles with larger pad & …

… processed separately and bonded together with direct hybrid bonding at room temperature
[2]. … Right is SEM view of 1 µm pitch hybrid bonding pads integrated with single damascene. …

… Direct hybrid bonding offers several advantages compared to other 3D … Indeed, direct hybrid
bonding benefits are the capability to reach easily interconnection pitches between 1μm to …

… Direct Bond Interconnect (DBI®) is the hybrid bonding platform … bonding at a pitch of 1 μm
for their NAND products [6]. Nevertheless, D2W hybrid bonding lags behind W2W pitch scaling …

… an interconnect pitch smaller than 40μm. Wafer-to-wafer (W2W) direct bond interconnect …
We measured CMP for the following bond pad sizes: 1 μm line width in a 20μm grid pattern, …

… Third, a 1 μm-thick Cu and 3 μm-thick Sn were sequentially electroplated on the Ti/Cu layer
… because the Cu/Sn bumps can be directly contacted with the Ti/Cu/Au film during the hybrid …

… a pitch of less than 1 μm. Furthermore, accurate control is essential for achieving high precision
in bonding … 10 illustrates a direct relationship between the misalignment value and the …

… Direct hybrid bonding technique is a key technology for … ) of W2W hybrid bonding Cu
interconnect pitch to around 1 μm. More … bonding pitch to further scale down to much less than 1 …