3D semiconductor device and structure with back-bias
Z Or-Bach, DC Sekar, B Cronquist, I Beinglass… - US Patent …, 2015 - Google Patents
H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state
devices during manufacture or treatment thereof; Apparatus specially adapted for handling
wafers during manufacture or treatment of semiconductor or electric solid state devices or
components; Apparatus not specifically provided for elsewhereH01L21/683—Apparatus
specially adapted for handling semiconductor or electric solid state devices during
manufacture or treatment thereof; Apparatus specially adapted for handling wafers during …
devices during manufacture or treatment thereof; Apparatus specially adapted for handling
wafers during manufacture or treatment of semiconductor or electric solid state devices or
components; Apparatus not specifically provided for elsewhereH01L21/683—Apparatus
specially adapted for handling semiconductor or electric solid state devices during
manufacture or treatment thereof; Apparatus specially adapted for handling wafers during …
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