We discuss two emerging technologies that are central for realizing an optically powered flexible bioelectronic system. First, we discuss layer transfer through controlled spalling technology for producing high-performance flexible electronics. We present three examples: (1) advanced-node ultra-thin body silicon integrated circuits on plastic, (2) strain engineering in flexible electronics, and (3) flexible GaAs photovoltaic energy harvesters. Second, a 4-terminal biosensor is presented that is compatible with ultra-thin body silicon CMOS technology. Through in vitro glucose sensing, we demonstrate that the 4-terminal integrated biosensor enables the amplification of biochemical signals at the device level. These advanced technologies can give rise to an unprecedented boost in the performance and functionality of next-generation wearable devices.