An exploration for the degradation behavior of 2-D electrostatic microscanners by accelerated lifetime test
D Qiao, R Zhao, Y Zhang, C Xia, X Song… - Microelectronics …, 2018 - Elsevier
Failure analysis for the MEMS device is a crucial step in understanding the root causes of
failure and improving the performance of the device. In order to explore the degradation
failure mechanisms of 2-D electrostatic microscanners, three steps were addressed in this
paper. Firstly, the stress distribution of the microscanner under its operation state was
simulated using the finite element method (FEM), and the results showed that the middle
part on the frame torsion beam was the most critical place. In the second step, accelerated …
failure and improving the performance of the device. In order to explore the degradation
failure mechanisms of 2-D electrostatic microscanners, three steps were addressed in this
paper. Firstly, the stress distribution of the microscanner under its operation state was
simulated using the finite element method (FEM), and the results showed that the middle
part on the frame torsion beam was the most critical place. In the second step, accelerated …