An inductively coupled wireless bus for chiplet-based systems
J Kadomoto, S Mitsuno, H Irie… - 2020 25th Asia and …, 2020 - ieeexplore.ieee.org
J Kadomoto, S Mitsuno, H Irie, S Sakai
2020 25th Asia and South Pacific Design Automation Conference (ASP …, 2020•ieeexplore.ieee.orgA wireless bus for inter-chiplet communication is presented. Utilizing horizontal inductive
coupling of on-chip coils, wireless connection between chiplets are established. A test chip
prototyped in 0.18 μm CMOS confirms 2.0 Gb/s bus communication between horizontally
arranged coils with BER of less than 10-12.
coupling of on-chip coils, wireless connection between chiplets are established. A test chip
prototyped in 0.18 μm CMOS confirms 2.0 Gb/s bus communication between horizontally
arranged coils with BER of less than 10-12.
A wireless bus for inter-chiplet communication is presented. Utilizing horizontal inductive coupling of on-chip coils, wireless connection between chiplets are established. A test chip prototyped in 0.18 μm CMOS confirms 2.0 Gb/s bus communication between horizontally arranged coils with BER of less than 10 -12 .
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