In this paper, we report on the use of tantalum as adhesion layer for platinum electrodes used in high-temperature SAW devices based on langasite substrates (LGS). Tantalum exhibits a great adhesive strength and a very low mobility through the Pt film, ensuring a device lifetime at 900°C of about one hour in an air atmosphere and at least 20 h under vacuum. The latter is limited by morphological modifications of platinum, starting with the apparition of crystallites on the surface, followed by important terracing and breaking of the film continuity. Secondary neutral mass spectroscopy (SNMS), Auger electron spectroscopy (AES), X-ray diffraction (XRD) measurements, and comparison with iridium-based electrodes allowed us to show that this deterioration is likely intrinsic to platinum film, consisting of agglomeration phenomena. Finally, based on these results, we present a solution that could significantly enhance the lifetime of Pt-based IDTs placed in high-temperature conditions.