CUF scaling effect on contact angle and threshold pressure
… This paper aims to present experimental and finite volume method (FVM)-based
simulation studies on the scaling effect on the capillary contact angle and entrant pressure for
a three-dimensional encapsulation process of ball-grid array (BGA). … This study relates the
flow behaviour of encapsulant to its capillary contact angle and Leverett-J pressure threshold,
in the CUF process of different BGA and dispensing conditions. To date, no research has
been found to predict the threshold pressure on the gap between the chip and substrate. …
simulation studies on the scaling effect on the capillary contact angle and entrant pressure for
a three-dimensional encapsulation process of ball-grid array (BGA). … This study relates the
flow behaviour of encapsulant to its capillary contact angle and Leverett-J pressure threshold,
in the CUF process of different BGA and dispensing conditions. To date, no research has
been found to predict the threshold pressure on the gap between the chip and substrate. …
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