Chemical mechanical polishing composition and method for tungsten
J De Peng, LC Ho, BPH Chi - US Patent 10,640,681, 2020 - Google Patents
A composition and method for chemical mechanical polishing a substrate containing
tungsten to at least inhibit corrosion of the tungsten. The composition includes, as initial
components: water; an oxidizing agent; a select polyethoxylated tallow amine; a dicarboxylic
acid, a source of iron ions; a colloidal silica abrasive; and, optionally, a pH adjusting agent;
and, optionally, a biocide. The chemical mechanical polishing method includes providing a
chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at …
tungsten to at least inhibit corrosion of the tungsten. The composition includes, as initial
components: water; an oxidizing agent; a select polyethoxylated tallow amine; a dicarboxylic
acid, a source of iron ions; a colloidal silica abrasive; and, optionally, a pH adjusting agent;
and, optionally, a biocide. The chemical mechanical polishing method includes providing a
chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at …
Chemical mechanical polishing composition and method for tungsten
J De Peng, LC Ho, BPH Chi - US Patent 10,597,558, 2020 - Google Patents
(57) ABSTRACT A composition and method for chemical mechanical polish ing a substrate
containing tungsten to at least inhibit corro sion of the tungsten. The composition includes,
as initial components: water; an oxidizing agent; select fatty amine ethoxylate; a dicarboxylic
acid, a source of iron ions; a colloidal silica abrasive; and, optionally, a pH adjusting agent;
and, optionally, a biocide. The chemical mechanical polishing method includes providing a
chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at …
containing tungsten to at least inhibit corro sion of the tungsten. The composition includes,
as initial components: water; an oxidizing agent; select fatty amine ethoxylate; a dicarboxylic
acid, a source of iron ions; a colloidal silica abrasive; and, optionally, a pH adjusting agent;
and, optionally, a biocide. The chemical mechanical polishing method includes providing a
chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at …