Coating of Titanium Nitride Thin Film on Stainless Steel Using an RF Planar Coil Inductively Coupled Plasma
Titanium nitride (TiN) thin film is grown on 304-stainless steel plate by Plasma Enhanced
Physical Vapour Deposition (PEPVD) method in an RF Planar Coil Inductively Coupled
Plasma (PC ICP) system. H-mode discharge in $ Ar-N_ {2} $ admixture is produced for this
purpose. The titanium target is biased at a negative voltage of â â ‚¬ †800V, while the
substrate is biased at voltage ranging from 0 to â â ‚¬ †160V in step of 20V to study the
effect of substrate bias voltage on the quality of the TiN thin film obtained. The composition …
Physical Vapour Deposition (PEPVD) method in an RF Planar Coil Inductively Coupled
Plasma (PC ICP) system. H-mode discharge in $ Ar-N_ {2} $ admixture is produced for this
purpose. The titanium target is biased at a negative voltage of â â ‚¬ †800V, while the
substrate is biased at voltage ranging from 0 to â â ‚¬ †160V in step of 20V to study the
effect of substrate bias voltage on the quality of the TiN thin film obtained. The composition …
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