An electrical device includes at least one electrical compo nent arranged on a carrier
substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the
carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally
surround the at least one electrical component. Further, the electrical device includes a heat
sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink
forms a cap of the electromagnetic shielding encapsulation and the heat sink includes …