Electromigration induced ductile-to-brittle transition in lead-free solder joints
The effect of electromigration on ductile-to-brittle transition in flip chip solder joints has been
studied using one-dimensional bamboo-type samples of eutectic 95.5 Sn–3.8 Ag–0.7 Cu
solder joined by Cu wires at two ends. Both electrical current and tensile stress were applied
to the samples either in serial or in parallel. In serial tests, the strain rate was 6× 10− 3. In
parallel test, the creep stress was 7 MPa. The current density applied was (1–5)× 10 3 A∕
cm 2. The working temperature was 100–150 C. In both tests, the authors observed the …
studied using one-dimensional bamboo-type samples of eutectic 95.5 Sn–3.8 Ag–0.7 Cu
solder joined by Cu wires at two ends. Both electrical current and tensile stress were applied
to the samples either in serial or in parallel. In serial tests, the strain rate was 6× 10− 3. In
parallel test, the creep stress was 7 MPa. The current density applied was (1–5)× 10 3 A∕
cm 2. The working temperature was 100–150 C. In both tests, the authors observed the …
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