IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures
H Köck, V Košel, C Djelassi, M Glavanovics… - Microelectronics …, 2009 - Elsevier
A calibrated system for power metal reliability analysis in smart power technology chips is
presented. This system is mainly designed for temperature evaluation during temperature-
cycling experiments. Infrared camera measurements under single shot high energy pulses
are correlated with electro-thermal finite element simulation and failure analysis. A special
test structure, containing poly-silicon heaters, is used to produce thermal stress. The location
of a hot spot agrees well with the position of degraded power metal.
presented. This system is mainly designed for temperature evaluation during temperature-
cycling experiments. Infrared camera measurements under single shot high energy pulses
are correlated with electro-thermal finite element simulation and failure analysis. A special
test structure, containing poly-silicon heaters, is used to produce thermal stress. The location
of a hot spot agrees well with the position of degraded power metal.
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