… This paper describes an improved method of forming and removing seed layers for
through-silicon-vias (TSVs) in applications such as MEMS, sensors and packaging (silicon carrier, for …

… The very first step in the fabrication of a c-Si wafer is the production of metallurgical grade
silicon via the high-temperature reduction of silica (the source of which is typically lumpy quartz…

… Half cells of Si/Li, when cycled at a constant … improvement in the battery performance with
cycle life (>650 cycles and columbic efficiencies close to 100%). Finally, in order to improve the …

… This technology allows stacked silicon chips to interconnect through direct contact to
provide high-speed signal processing and improved photo detection for image sensing. …

… cuit model for through silicon via (TSV) with consideration of the effective substrate current
loop in silicon substrate and proximity effect on the currents in the TSV. The proposed model …

… -TEM modes in through-silicon via (TSV… through-silicon via (TSV) based on the conformal
mapping method to modify the conventional model in admittance (CG) parts. With the improved …

Temperature and thermal stress responses of an improved TTSV structure under the impact
of hotspots are numerically analyzed in this paper. A Fin structure is added to the circular …

… inductor and the Si substrate to reduce loss and improve the Q … for 3D connections is the
through silicon via (TSV) [3,4], which … focus on improving the inductor performance through the …

… Through Silicon Via (TSV) testing methods and improve the … Transmission Line Model
and improved through the fitting to … TSVs that alters the paths through which current flows is …

Introduction. Through-silicon-via (TSV) is one of the most important components of 3D
integrated circuits. Similar to two-dimensional circuits, the performance evaluation of 3D circuits …