Interrelationship of thermal parameters, microstructure and microhardness of directionally solidified Bi–Zn solder alloys

RS Septimio, TA Costa, TA Vida, A Garcia… - Microelectronics …, 2017 - Elsevier
Due to the health and environmental concerns associated with lead usage, the research on
alternative lead-free alloys for replacing lead-based solders is a global demand. Despite
numerous studies on Sn-based lead-free solders in recent years, there is not yet a standard
solder alloy able to cover the spectrum of properties furnished by the classic Sn-Pb alloy. In
this sense, particular lead-free alloys compositions have been suited for specific needs and
the options have been broadening when elements other than tin are used as the base …
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