Disclosed herein are implementations of methods and devices for stacking printed circuit
board (PCB) assemblies (PCBA) with a single reflow process which decreases impact on
surface mount technology (SMT) component and solder joint reliability. A method includes
transferring solder paste on to a bottom PCB and forming a bottom PCBA by placing SMT
components on the bottom PCB. A middle PCB is stacked on the bottom PCBA and solder
paste is transferred on to the middle PCB. A top PCB is stacked on the middle PCB and …

… Disclosed herein are implementations of methods and devices for stacking printed circuit
board assemblies with a single reflow process. This decreases impact on surface mount
technology (SMT) component and solder joint reliability. In addition, the processes are
suitable for packages smaller than the 0201-package size. … The non-limiting
embodiments described herein are with respect to a method for printed circuit board (PCB)
assembly (PCBA) stacking with a single reflow. The method for PCBA stacking with a single …