Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor
WF Landers, TM Shaw, D Llera-Hurlburt… - US Patent …, 2006 - Google Patents
An on-chip redundant crack termination barrier structure, or crackstop, provides a barrier for
preventing defects, cracks, delaminations, and moisture/oxidation contaminants from
reaching active circuit regions. Conductive materials in the barrier structure design permits
wiring the barriers out to contact pads and device pins for coupling a monitor device to the
chip for monitoring barrier integrity.
preventing defects, cracks, delaminations, and moisture/oxidation contaminants from
reaching active circuit regions. Conductive materials in the barrier structure design permits
wiring the barriers out to contact pads and device pins for coupling a monitor device to the
chip for monitoring barrier integrity.
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