Package having integral lens and wafer-scale fabrication method therefor
C De Villeneuve, G Humpston… - US Patent App. 10 …, 2005 - Google Patents
(57) ABSTRACT A covered chip having an optical element integrated in the cover is
provided Which includes a chip having a front surface, an optically active circuit area, and
bond pads disposed at the front surface. The chip is covered by an at least partially optically
translucent or transparent unitary cover that is mounted to the front surface of the chip, and
has at least one optical element integrated in the unitary cover. The cover is further aligned
With the optically active circuit area and vertically spaced from the optically active circuit …
provided Which includes a chip having a front surface, an optically active circuit area, and
bond pads disposed at the front surface. The chip is covered by an at least partially optically
translucent or transparent unitary cover that is mounted to the front surface of the chip, and
has at least one optical element integrated in the unitary cover. The cover is further aligned
With the optically active circuit area and vertically spaced from the optically active circuit …