A package-on-package (PoP) device includes a first package, a second package, and a bi-
directional thermal electric cooler (TEC). The first package includes a first substrate and a
first die coupled to the first substrate. The second package is coupled to the first package.
The second package includes a second substrate and a second die coupled to the second
substrate. The TEC is located between the first die and the second substrate. The TEC is
adapted to dynamically dissipate heat back and forth between the first package and the …

G01K7/04—Measuring temperature based on the use of electric or magnetic elements
directly sensitive to heat; Power supply therefor, eg using thermoelectric elements using
thermoelectric elements, eg thermocouples the object to be measured not forming one of the
thermoelectric materials