This paper focuses on parametric effect study and optimization for photochemical machining of copper. The objective of the study is to analyze the parametric effect of concentration of etchant, temperature, and etching time on material removal rate (MRR) and edge deviation (ED). The photochemical machining of copper has been carried out based on Taguchi L9 array using ferric chloride as etchant. The effect of process parameters on output parameters has been studied using Analysis of Variance (ANOVA). The material removal rate should be high while edge deviation is always desired lesser. For achieving this multi-objective condition, overall evaluation criteria (OEC) have been formulated by assigning equal weight percentage to MRR and ED. The optimum condition predicted by OEC is at a concentration of 600 g/L, temperature of 40°C, and 21 minutes etching time