This paper describes an approach for the reduction of plasma-induced damage in self-
assembly based porous ultra low-k organosilica dielectrics. The concept is based on
retention of the partially decomposed sacrificial organic phase (template) into the pores of
the low-k film during plasma exposure. The amount of the template residues can be
controlled by varying the hard-bake process time. It is shown that those residues are
uniformly distributed throughout the film in the form of pore wall coatings. After plasma …