Abstract Although Zn–Sn alloys have suitable features for high temperature solders, as for
example the absence of intermetallic compounds (IMCs) and relatively high melting
temperatures, the control of the scale of the microstructure by adequate pre-programming of
the solidification thermal parameters remains still a task to be accomplished. The present
study focuses on the interrelation among hardness, microstructure features/segregation and
solidification thermal parameters. An upward directional transient solidification apparatus …